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  1. Three-Dimensional Integration of Semiconductors Three-Dimensional Integration of Semiconductors

    Three-Dimensional Integration of Semiconductors

    Kazuo Kondo
    Springer International Publishing, Springer International Publishing
    16.12.2015

    This book starts with background concerning three-dimensional integration - including their low e...

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    106,99 €
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  2. Copper Electrodeposition for Nanofabrication of Electronics Devices Copper Electrodeposition for Nanofabrication of Electronics Devices

    Copper Electrodeposition for Nanofabrication of Electronics Devices

    Kazuo Kondo
    Springer New York, Springer New York
    21.11.2013

    This book discusses the scientific mechanism of copper electrodeposition and it's wide range of a...

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    106,99 €
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  3. Cuprous is key to acceleration in Copper bottom up filling Cuprous is key to acceleration in Copper bottom up filling

    Cuprous is key to acceleration in Copper bottom up filling

    Kazuo Kondo
    LAP Lambert Academic Publishing
    23.08.2017

    Copper has one third the resistivity of Aluminum and can be electrodeposited easily. Hence, Coppe...

    Taschenbuch
    21,90 €
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  4. Three-Dimensional Integration of Semiconductors Three-Dimensional Integration of Semiconductors

    Three-Dimensional Integration of Semiconductors

    Kazuo Kondo
    Springer International Publishing, Springer International Publishing
    28.03.2019

    This book starts with background concerning three-dimensional integration - including their low e...

    Taschenbuch
    160,49 €
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  5. Copper Electrodeposition for Nanofabrication of Electronics Devices Copper Electrodeposition for Nanofabrication of Electronics Devices

    Copper Electrodeposition for Nanofabrication of Electronics Devices

    Kazuo Kondo
    Springer New York, Springer US
    23.08.2016

    This book discusses the scientific mechanism of copper electrodeposition and it's wide range of a...

    Taschenbuch
    85,59 €
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